Heat dissipating fin, heat dissipating device and method of manufacturing the same

ABSTRACT

A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a heat dissipating fin, a heat dissipatingdevice and a method of manufacturing the same and, more particularly, toa heat dissipating fin capable of preventing overflow whilemanufacturing a heat dissipating device.

2. Description of the Prior Art

Heat dissipating device is a significant component for electronicproducts. When an electronic product is operating, the current incircuit will generate unnecessary heat due to impedance. If the heat isaccumulated in the electronic components of the electronic productwithout dissipating immediately, the electronic components may getdamage due to the accumulated heat. Therefore, the performance of heatdissipating device is a significant issue for the electronic product.

Referring to FIGS. 1 and 2, FIG. 1 is a schematic diagram illustrating aflat-type heat dissipating fin 12 of the prior art, and FIG. 2 is aschematic diagram illustrating a cylinder-type heat dissipating fin 22of the prior art. In general, a heat dissipating device is usuallyequipped with a flat-type heat dissipating fin 12 shown in FIG. 1 or acylinder-type heat dissipating fin 22 shown in FIG. 2. As shown in FIGS.1 and 2, the flat-type heat dissipating fin 12 and the cylinder-typeheat dissipating fin 22 are formed with the bases 10, 20 integrally by adie casting process. Due to the requirement of mold stripping during thedie casting process, the flat-type heat dissipating fin 12 or thecylinder-type heat dissipating fin 22 has a draft angle a between 2degrees and 3 degrees so that the whole weight of the fin is heavy andthe height of the fin is limited. Furthermore, the number of heatdissipating fins is reduced in the heat dissipating device due to thedraft angle a so that the heat dissipating area is not enough and theheat dissipating efficiency is worse.

SUMMARY OF THE INVENTION

The invention provides a heat dissipating fin capable of preventingoverflow while manufacturing a heat dissipating device. The heatdissipating fin is formed by a forming process without the draft angleof the conventional heat dissipating fin, so as to solve the aforesaidproblems.

As mentioned in the above, the invention forms the heat dissipating finby the forming process (e.g. aluminum extrusion process, rivet formingprocess, etc.) first and then forms the base, which covers the fixingportion of the heat dissipating fin, by the die casting process with themelt metal material. The heat dissipating fin of the invention has theoverflow-proof structure capable of preventing the melt metal materialfrom overflowing during the die casting process so as to prevent deckleedge from being generated. Since the heat dissipating fin of theinvention is formed by the forming process, the draft angle of theconventional heat dissipating fin is unnecessary for the heatdissipating fin of the invention. Therefore, the whole weight of theheat dissipating fin of the invention can be lighter and the height ofthe heat dissipating fin of the invention can be higher than the priorart. Furthermore, the number of heat dissipating fins of the inventioncan be increased in the heat dissipating device so that the heatdissipating area can be increased and the heat dissipating efficiencycan be enhanced.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram illustrating a flat-type heat dissipatingfin of the prior art.

FIG. 2 is a schematic diagram illustrating a cylinder-type heatdissipating fin of the prior art.

FIG. 3 is a schematic diagram illustrating a heat dissipating deviceaccording to a first embodiment of the invention.

FIG. 4 is a cross-sectional view illustrating the heat dissipatingdevice along line A-A shown in FIG. 3.

FIG. 5 is a schematic diagram illustrating the heat dissipating finshown in FIG. 3.

FIG. 6 is a flowchart illustrating a method of manufacturing the heatdissipating device shown in FIG. 3.

FIG. 7 is a cross-sectional view illustrating a heat dissipating finaccording to a second embodiment of the invention.

FIG. 8 is a cross-sectional view illustrating a heat dissipating finaccording to a third embodiment of the invention.

FIG. 9 is a cross-sectional view illustrating a heat dissipating finaccording to a fourth embodiment of the invention.

FIG. 10 is a cross-sectional view illustrating a heat dissipating finaccording to a fifth embodiment of the invention.

FIG. 11 is a cross-sectional view illustrating the heat dissipatingdevice along line B-B shown in FIG. 10.

FIG. 12 is a schematic diagram illustrating the heat dissipating finshown in FIG. 10.

FIG. 13 is a flowchart illustrating a method of manufacturing the heatdissipating device shown in FIG. 10.

FIG. 14 is a cross-sectional view illustrating a heat dissipating finaccording to a sixth embodiment of the invention.

DETAILED DESCRIPTION

Referring to FIGS. 3 to 5, FIG. 3 is a schematic diagram illustrating aheat dissipating device 3 according to a first embodiment of theinvention, FIG. 4 is a cross-sectional view illustrating the heatdissipating device 3 along line A-A shown in FIG. 3, and FIG. 5 is aschematic diagram illustrating the heat dissipating fin 32 shown in FIG.3. As shown in FIGS. 3 and 4, the heat dissipating device 3 comprises abase 30 and a plurality of heat dissipating fins 32. As shown in FIGS. 4and 5, each of the heat dissipating fins 32 comprises a heat dissipatingportion 320, a fixing portion 322 and an overflow-proof structure 324.The fixing portion 322 is fixed in the base 30. The overflow-proofstructure 324 is connected between the heat dissipating portion 320 andthe fixing portion 322. A width W1 of the overflow-proof structure 324is larger than a width W2 of the heat dissipating portion 320 and largerthan a width W3 of the fixing portion 322. In this embodiment, a lengthL of the overflow-proof structure 324 protruded from the fixing portion322 can be between 1 mm and 10 mm, wherein a thickness of theoverflow-proof structure 324 is uniform. In another embodiment, athickness of the overflow-proof structure 324 may vary gradiently.

Furthermore, each of the heat dissipating fins 32 may further comprise arecess structure 326 formed on the fixing portion 322. In thisembodiment, the recess structure 326 is arc-shaped. In anotherembodiment, the recess structure 326 may be polygon-shaped.

Referring to FIG. 6, FIG. 6 is a flowchart illustrating a method ofmanufacturing the heat dissipating device 3 shown in FIG. 3. First ofall, step S100 is performed to form a plurality of heat dissipating fins32 by a forming process. In this embodiment, the aforesaid formingprocess may be an aluminum extrusion process so as to form each of theheat dissipating fins 32 as a flat-type heat dissipating fin. Afterward,step S102 is performed to put the fixing portion 322 of each of the heatdissipating fins 32 into a mold (not shown). Step S104 is then performedto pour a melt metal material (e.g. aluminum, etc.) into the mold.Finally, step S106 is performed to process the melt metal material by adie casting process so as to form the base 30, wherein the base 30covers the fixing portion 322 of each of the heat dissipating fins 32,as shown in FIG. 4. In this embodiment, the overflow-proof structure 324of each of the heat dissipating fins 32 is capable of preventing themelt metal material from overflowing during the die casting process soas to prevent deckle edge from being generated. When the length L of theoverflow-proof structure 324 protruded from the fixing portion 322 isbetween 1 mm and 10 mm, the overflow-proof structure 324 can prevent themelt metal material from overflowing during the die casting processeffectively so as to prevent deckle edge from being generated.Furthermore, the recess structure 326 of each of the heat dissipatingfins 32 can hold the metal material effectively so as to enhance thecombination strength between the base 30 and the heat dissipating fins32.

Referring to FIG. 7 along with FIG. 4, FIG. 7 is a cross-sectional viewillustrating a heat dissipating fin 42 according to a second embodimentof the invention. The difference between the heat dissipating fin 42 andthe aforesaid heat dissipating fin 32 is that the heat dissipating fin42 further comprises a protruding structure 420. As shown in FIG. 7, theprotruding structure 420 protrudes from one end of the fixing portion322. When the heat dissipating fin 32 shown in FIG. 4 is replaced by theheat dissipating fin 42 shown in FIG. 7, the protruding structure 420 ofthe heat dissipating fin 42 can cooperate with the overflow-proofstructure 324 to hold the metal material so as to enhance thecombination strength between the base 30 and the heat dissipating fin42. It should be noted that the same elements in FIG. 7 and FIG. 4 arerepresented by the same numerals, so the repeated explanation will notbe depicted herein again. Moreover, the heat dissipating fin 42 can bealso formed by the forming process of the aforesaid step S100.

Referring to FIG. 8 along with FIG. 4, FIG. 8 is a cross-sectional viewillustrating a heat dissipating fin 52 according to a third embodimentof the invention. The difference between the heat dissipating fin 52 andthe aforesaid heat dissipating fin 32 is that the heat dissipating fin52 further comprises a hook structure 520. As shown in FIG. 8, the hookstructure 520 is formed in the recess structure 326. When the heatdissipating fin 32 shown in FIG. 4 is replaced by the heat dissipatingfin 52 shown in FIG. 8, the hook structure 520 of the heat dissipatingfin 52 can hook the metal material so as to enhance the combinationstrength between the base 30 and the heat dissipating fin 52. It shouldbe noted that the same elements in FIG. 8 and FIG. 4 are represented bythe same numerals, so the repeated explanation will not be depictedherein again. Moreover, the heat dissipating fin 52 can be also formedby the forming process of the aforesaid step S100.

Referring to FIG. 9 along with FIG. 4, FIG. 9 is a cross-sectional viewillustrating a heat dissipating fin 62 according to a fourth embodimentof the invention. The difference between the heat dissipating fin 62 andthe aforesaid heat dissipating fin 32 is that the heat dissipating fin62 further comprises an extending structure 620 and does not comprisethe aforesaid recess structure 326. As shown in FIG. 9, the extendingstructure 620 is extended from the overflow-proof structure 324 towardthe fixing portion 322, and the overflow-proof structure 324 and theextending structure 620 are formed as U-shape. When the heat dissipatingfin 32 shown in FIG. 4 is replaced by the heat dissipating fin 62 shownin FIG. 9, the extending structure 620 of the heat dissipating fin 62can cooperate with the overflow-proof structure 324 to hold the metalmaterial so as to enhance the combination strength between the base 30and the heat dissipating fin 62. It should be noted that the sameelements in FIG. 9 and FIG. 4 are represented by the same numerals, sothe repeated explanation will not be depicted herein again. Moreover,the heat dissipating fin 62 can be also formed by the forming process ofthe aforesaid step S100.

Referring to FIGS. 10 to 12, FIG. 10 is a schematic diagram illustratinga heat dissipating device 7 according to a fifth embodiment of theinvention, FIG. 11 is a cross-sectional view illustrating the heatdissipating device 7 along line B-B shown in FIG. 10, and FIG. 12 is aschematic diagram illustrating the heat dissipating fin 72 shown in FIG.10. As shown in FIGS. 10 and 11, the heat dissipating device 7 comprisesa base 70 and a plurality of heat dissipating fins 72. As shown in FIGS.11 and 12, each of the heat dissipating fins 72 comprises a heatdissipating portion 720, a fixing portion 722, an overflow-proofstructure 724 and a protruding structure 726. The fixing portion 722 andthe protruding structure 726 are fixed in the base 70. Theoverflow-proof structure 724 is connected between the heat dissipatingportion 720 and the fixing portion 722. A width W1 of the overflow-proofstructure 724 is larger than a width W2 of the heat dissipating portion720 and larger than a width W3 of the fixing portion 722. In thisembodiment, a length L of the overflow-proof structure 724 protrudedfrom the fixing portion 722 can be between 1 mm and 10 mm. Theprotruding structure 726 protrudes from one end of the fixing portion722. In this embodiment, a thickness of the overflow-proof structure 724varies gradiently. In another embodiment, a thickness of theoverflow-proof structure 724 may be uniform.

Referring to FIG. 13, FIG. 13 is a flowchart illustrating a method ofmanufacturing the heat dissipating device 7 shown in FIG. 10. First ofall, step S200 is performed to form a plurality of heat dissipating fins72 by a forming process. In this embodiment, the aforesaid formingprocess may be a rivet forming process so as to form each of the heatdissipating fins 72 as a cylinder-type heat dissipating fin. Afterward,step S202 is performed to put the fixing portion 722 and the protrudingstructure 726 of each of the heat dissipating fins 72 into a mold (notshown). Step S204 is then performed to pour a melt metal material (e.g.aluminum, etc.) into the mold. Finally, step S206 is performed toprocess the melt metal material by a die casting process so as to formthe base 70, wherein the base 70 covers the fixing portion 722 and theprotruding structure 726 of each of the heat dissipating fins 72, asshown in FIG. 11. In this embodiment, the overflow-proof structure 724of each of the heat dissipating fins 72 is capable of preventing themelt metal material from overflowing during the die casting process soas to prevent deckle edge from being generated. When the length L of theoverflow-proof structure 724 protruded from the fixing portion 722 isbetween 1 mm and 10 mm, the overflow-proof structure 724 can prevent themelt metal material from overflowing during the die casting processeffectively so as to prevent deckle edge from being generated.Furthermore, the protruding structure 726 of each of the heatdissipating fins 72 can cooperate with the overflow-proof structure 724to hold the metal material so as to enhance the combination strengthbetween the base 70 and the heat dissipating fins 72.

Referring to FIG. 14 along with FIG. 11, FIG. 14 is a cross-sectionalview illustrating a heat dissipating fin 82 according to a sixthembodiment of the invention. The difference between the heat dissipatingfin 82 and the aforesaid heat dissipating fin 72 is that the heatdissipating fin 82 further comprises a recess structure 820. As shown inFIG. 14, the recess structure 820 is formed on the fixing portion 722.When the heat dissipating fin 72 shown in FIG. 11 is replaced by theheat dissipating fin 82 shown in FIG. 14, the recess structure 820 ofthe heat dissipating fin 82 can hold the metal material effectively soas to enhance the combination strength between the base 70 and the heatdissipating fin 82. It should be noted that the same elements in FIG. 14and FIG. 11 are represented by the same numerals, so the repeatedexplanation will not be depicted herein again. Moreover, the heatdissipating fin 82 can be also formed by the forming process of theaforesaid step S200.

As mentioned in the above, the invention forms the heat dissipating finby the forming process (e.g. aluminum extrusion process, rivet formingprocess, etc.) first and then forms the base, which covers the fixingportion of the heat dissipating fin, by the die casting process with themelt metal material. The heat dissipating fin of the invention has theoverflow-proof structure capable of preventing the melt metal materialfrom overflowing during the die casting process so as to prevent deckleedge from being generated. Since the heat dissipating fin of theinvention is formed by the forming process, the draft angle of theconventional heat dissipating fin is unnecessary for the heatdissipating fin of the invention. Therefore, the whole weight of theheat dissipating fin of the invention can be lighter and the height ofthe heat dissipating fin of the invention can be higher than the priorart. Furthermore, the number of heat dissipating fins of the inventioncan be increased in the heat dissipating device so that the heatdissipating area can be increased and the heat dissipating efficiencycan be enhanced. Moreover, the invention may form the recess structure,the protruding structure, the hook structure and/or the extendingstructure on the heat dissipating fin so as to enhance the combinationstrength between the base and the heat dissipating fin.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

1. A heat dissipating fin comprising: a heat dissipating portion; afixing portion; and an overflow-proof structure connected between theheat dissipating portion and the fixing portion; wherein a width of theoverflow-proof structure is larger than a width of the heat dissipatingportion.
 2. The heat dissipating fin of claim 1, wherein a length of theoverflow-proof structure protruded from the fixing portion is between 1mm and 10 mm.
 3. The heat dissipating fin of claim 1, further comprisinga recess structure formed on the fixing portion.
 4. The heat dissipatingfin of claim 3, further comprising a hook structure formed in the recessstructure.
 5. The heat dissipating fin of claim 1, further comprising aprotruding structure protruded from one end of the fixing portion. 6.The heat dissipating fin of claim 1, further comprising an extendingstructure extended from the overflow-proof structure toward the fixingportion.
 7. The heat dissipating fin of claim 6, wherein theoverflow-proof structure and the extending structure are formed asU-shape.
 8. The heat dissipating fin of claim 1, wherein a thickness ofthe overflow-proof structure is uniform or varies gradiently.
 9. A heatdissipating device comprising: a base; and a plurality of heatdissipating fins, each of the heat dissipating fins comprising: a heatdissipating portion; a fixing portion fixed in the base; and anoverflow-proof structure connected between the heat dissipating portionand the fixing portion; wherein a width of the overflow-proof structureis larger than a width of the heat dissipating portion.
 10. The heatdissipating device of claim 9, wherein each of the heat dissipating finsfurther comprises a recess structure formed on the fixing portion. 11.The heat dissipating device of claim 10, wherein each of the heatdissipating fins further comprises a hook structure formed in the recessstructure.
 12. The heat dissipating device of claim 9, wherein each ofthe heat dissipating fins further comprises a protruding structureprotruded from one end of the fixing portion.
 13. The heat dissipatingdevice of claim 9, wherein each of the heat dissipating fins furthercomprises an extending structure extended from the overflow-proofstructure toward the fixing portion.
 14. The heat dissipating device ofclaim 13, wherein the overflow-proof structure and the extendingstructure are formed as U-shape.
 15. The heat dissipating device ofclaim 9, wherein a thickness of the overflow-proof structure is uniformor varies gradiently.
 16. A method of manufacturing a heat dissipatingdevice comprising: forming a plurality of heat dissipating fins by aforming process, wherein each of the heat dissipating fins comprises aheat dissipating portion, a fixing portion and an overflow-proofstructure, the overflow-proof structure is connected between the heatdissipating portion and the fixing portion, a width of theoverflow-proof structure is larger than a width of the heat dissipatingportion; putting the fixing portion of each of the heat dissipating finsinto a mold; pouring a melt metal material into the mold; and processingthe melt metal material by a die casting process so as to form a base,wherein the base covers the fixing portion of each of the heatdissipating fins and the overflow-proof structure of each of the heatdissipating fins prevents the melt metal material from overflowing. 17.The method of claim 16, wherein the forming process is an aluminumextrusion process and each of the heat dissipating fins is a flat-typeheat dissipating fin, or the forming process is a rivet forming processand each of the heat dissipating fins is a cylinder-type heatdissipating fin.
 18. The method of claim 16, wherein forming a pluralityof heat dissipating fins by a forming process further comprises forminga recess structure on the fixing portion.
 19. The method of claim 16,wherein forming a plurality of heat dissipating fins by a formingprocess further comprises forming a protruding structure on the fixingportion and enabling the protruding structure to protrude from one endof the fixing portion.
 20. The method of claim 16, wherein forming aplurality of heat dissipating fins by a forming process furthercomprises forming an extending structure on the overflow-proof structureand enabling the extending structure to extend from the overflow-proofstructure toward the fixing portion.
 21. The heat dissipating fin ofclaim 1, wherein the width of the overflow-proof structure is largerthan a width of the fixing portion.
 22. The heat dissipating device ofclaim 9, wherein the width of the overflow-proof structure is largerthan a width of the fixing portion.
 23. The method of claim 16, whereinthe width of the overflow-proof structure is larger than a width of thefixing portion.